Intel’s foundry division is poised for a significant advancement with its 18A-P process, as analyst Ming-Chi Kuo highlights Apple’s potential adoption of this technology for its entry-level MacBook and iPad chips. This partnership builds upon the ongoing trend of Apple supporting domestic manufacturing, aligning with Intel’s strategy to attract external clientele to its foundry services.
Intel has been actively courting external customers for processes like the 18A and its derivatives, and recent insights suggest that Apple is set to become a key client. Kuo’s analysis indicates that Apple is expected to implement Intel’s 18A-P process in the production of its lowest-tier M processors, with shipments anticipated as early as 2027.
While rumors of Intel as a foundry supplier for Apple have circulated for a while, recent industry surveys have increased confidence in this potential collaboration. Apple secured an NDA with Intel and has already received the advanced-node 18AP PDK 0.9.1GA. The company is assessing the initial stages of simulation and research associated with this technology and is eagerly awaiting the rollout of the subsequent PDK versions scheduled for early 2026.
Apple’s timeline indicates a hopeful outlook with the lowest-end M processor expected to launch in the second to third quarter of 2027. However, this timeline is dependent on the successful progression of PDK development.
Intel’s 18A-P process, introduced at the Direct Connect 2025 event, represents a transformative innovation for chip manufacturing. Designed to facilitate advanced chip stacking through Foveros Direct 3D hybrid bonding, the 18A-P process is tailored for optimal power efficiency, which complements Apple’s focus on creating high-performance chips with low power consumption. An exclusive NDA between the two companies signals that Apple might become a vital customer for this technology.
Kuo anticipates that Apple’s adoption of this process could lead to the production of 15 to 20 million units of M-series chips by 2027. The partnership’s potential not only signifies a positive development for Intel but also reflects Apple’s strategic inclination toward diversifying its supply chain amid its ongoing relationship with TSMC.
The 18A-P process presents an exciting opportunity for companies emphasizing power efficiency, and Apple’s potential leadership in adopting this technology is both promising and indicative of a shift towards a robust collaboration within the semiconductor industry. As Intel moves forward with its foundry ambitions, this partnership may play a crucial role in fostering innovation and expanding manufacturing capabilities in the United States.